We have versatile horizontal furnace system that is configurable to meet our customer demands in the semiconductor, solar, MEMS and photonics industries. Its use ranges from small batch R&D and pilot line production purposes, to high volume manufacturing processing. Our R&D systems are used in many advanced research centers worldwide, with state of the art proccesses and continuously new process developments.

Key system features

• Multipurpose atmospheric and CVD processing chambers available, applicable to any kind of silicon wafer, i.e. 100mm-300mm round (semiconductor) wafers, 125 – >156mm square (solar) wafers
• Batch processing from 25 up to 1000 wafers per tube
• Modular set up of the equipment, 1-4 tubes. Empty tubes are retrofittable in the future with additional/new processing
• Atmospheric processes: annealing (N2, forming gas), dry/wet oxide, POCl3, BBr3
• LPCVD processes: doped/undoped poly, silicon nitride, TEOS, LTO, HTO, SIPOS
• ALD: Al2O3, TiO2, HfO2
• Small footprint, manually loaded, or fully automated wafer transfer tools available

Customer benefits

• From lab to fab: All processes are easily exchangeable from lab scale to high volume manufacturing
• Full process and service support team available, direct from Tempress headquarters
• High level of flexibility in choice of processing
• All systems are backwards compatible. This guarantees full support at any time in the future for your Tempress furnace equipment
• Access to Tempress’ comprehensive in-house knowledge of semiconductor processing which can be applied to Solar cell manufacturing solutions as well